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Advanced chip packaging market size likely to grow to $79.85bn by 2032

India, Aug. 27 -- The global advanced chip packaging market is estimated to be valued at USD 50.38 billion in 2025, and is expected to reach USD 79.85 billion by 2032, exhibiting a CAGR of 6.8% from 2... Read More


Lip-Bu Tan to be honored with 2025 Phil Kaufman Award

India, Aug. 27 -- Lip-Bu Tan, Chief Executive Officer of Intel Corp., and former CEO of Cadence Design Systems, will be honored with the 2025 Phil Kaufman Award for distinguished contributions to Elec... Read More


Challenges in building accurate language models for diverse linguistic contexts

India, Aug. 26 -- Imagine opening an app designed to help you manage your small business online only to discover every menu, option, and instruction is in a language you don't fully understand. You're... Read More


NVIDIA Jetson Thor targets advanced humanoid apps, driving humanoid robot chip market to exceed $48 million by 2028

India, Aug. 26 -- NVIDIA's newly launched Jetson Thor acts as the "physical intelligence core" of humanoid robots, integrating the Blackwell GPU and 128 GB of memory to deliver 2,070 FP4 TFLOPS of AI ... Read More


From ferrying wash-basins to entire bathrooms

India, Aug. 26 -- And from guesswork to sure-footed buildings. Gone are the days when a lot of work was done when the horses were out of the stables to a horses-for-courses designs with BIM, digital t... Read More


Capgemini to acquire Cloud4C to boost hybrid cloud and AI services

India, Aug. 26 -- Capgemini announced that it has signed an agreement to acquire Cloud4C, a managed services provider specialising in hybrid and sovereign cloud environments. The deal, subject to regu... Read More


indie Semiconductor to acquire automotive perception software leader emotion3D

India, Aug. 26 -- indie Semiconductor, an automotive solutions innovator, has signed a definitive agreement to acquire emotion3D GmbH, a Vienna, Austria-based specialist developer of advanced percepti... Read More


OKI develops tiling CFB tech for HI of optical semiconductors onto 300 mm silicon wafers

India, Aug. 26 -- OKI has successfully developed tiling crystal film bonding (CFB) technology using its proprietary CFB technology. This technology makes possible the heterogeneous integration of sma... Read More


Toshiba releases automotive photorelay in small package for automotive battery systems

India, Aug. 26 -- Toshiba Electronic Devices & Storage Corp. has launched an automotive photorelay[, "TLX9161T," in a small SO12L-T package, that achieves an output withstand voltage of 1500V (min), t... Read More


Hyundai Mobis acquires semiconductor development process certification for ISO 26262 ASIL-D

India, Aug. 26 -- Hyundai Mobis has obtained the highest grade of ISO 26262 certification, an international standard for functional safety, for its entire vehicle semiconductor R&D process. It is note... Read More